<http://webisa.webdatacommons.org/265528741>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/54763025>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/265528741> .
<http://webisa.webdatacommons.org/265528741>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .
<http://webisa.webdatacommons.org/265528741>	<http://www.w3.org/ns/prov#value>	"nd metallization process optimized to maximize reflectanceUS62034073 Sep 199820 Mar 2001Micron Technology, Inc.Method and apparatus for increasing-chemical-polishing selectivityUS622177524 Sep 199824 Abr 2001International Business Machines Corp.Combined chemical mechanical polishing and reactive ion etching processUS622227330 Ene 199824 Abr 2001Micron Technology, Inc.System having vias including c" .