"An IC chip mounting method and an IC chip-mounted unit manufactured by the method as an example of an electronic component mounting method and an electronic component-mounted unit manufactured by the method according to a second embodiment of the present invention are explained with reference to FIGS. 5A, 5B, 5C and 5D. FIGS. 5A and 5B are a side view and a rear view of an IC chip prior to a bondi" . . . . .