<http://webisa.webdatacommons.org/prov/334813002>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/267064127> .
<http://webisa.webdatacommons.org/267064127>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/288195952>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/267064127> .
<http://webisa.webdatacommons.org/267064127>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/267064127>	<http://www.w3.org/ns/prov#value>	"In general, a semiconductor package is fabricated using a substrate such as lead frame, printed circuit board, circuit film, circuit tape, or the like." .