<http://webisa.webdatacommons.org/269942386>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/269942386>	<http://www.w3.org/ns/prov#value>	"An encapsulant 110 (shown in FIG. 1B), which may be an epoxy, mold compound, or other encapsulating material, covers IC die 102 and bond wires 108 for mechanical and environmental protection." .
<http://webisa.webdatacommons.org/269942386>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/57689155>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/269942386> .
<http://webisa.webdatacommons.org/prov/292921973>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/269942386> .