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<http://webisa.webdatacommons.org/prov/57446325>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/269945002> .
<http://webisa.webdatacommons.org/269945002>	<http://www.w3.org/ns/prov#value>	"In embodiments of the process, the vias are lined with a diffusion barrier layer and/or an adhesion layer, as known in the art, and filled with tungsten or other suitable conductive material." .
<http://webisa.webdatacommons.org/269945002>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .