<http://webisa.webdatacommons.org/prov/334212190>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/275277507> .
<http://webisa.webdatacommons.org/prov/332664350>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/275277507> .
<http://webisa.webdatacommons.org/275277507>	<http://www.w3.org/ns/prov#value>	"FIGS. 8A and 8B are a sectional view and a plan view showing one step of manufacturing the MIS type integrated circuit in an eighth embodiment of the present invention;" .
<http://webisa.webdatacommons.org/prov/333509763>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/275277507> .
<http://webisa.webdatacommons.org/275277507>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/275277507>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/334125931>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/275277507> .