. . "FIGS. 16A to 16C show fuses in a semiconductor device according to the seventh embodiment of the present invention, in which FIG. 16A is a top view partly cut to show parts positions, FIG. 16B is a sectional view taken along a line I???I of FIG. 16A, and FIG. 16C is a sectional view taken along a line II???II of FIG. 16A. An opening 4 is formed in a polyimide film 1 and a passivation film 7." . .