. . . . . "The electroless barrier layer may comprise any metal elements that can be deposited out of a liquid composition (either aqueous, primarily aqueous, primarily non-aqueous, or non-aqueous), e.g. Co, Mo, W, Ru, Mn, Ir, Sn, Ni, Rh, Re, and other alloying elements such as B, P. Additionally, Pt can form MPtSi by reacting with MSi, thus improving contact performance." . .