<http://webisa.webdatacommons.org/292112185> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/ns/prov#Entity> . <http://webisa.webdatacommons.org/292112185> <http://www.w3.org/ns/prov#value> "In one embodiment of the invention there is a product to be used to reduce the thermal (electrical) interface resistance between two connecting devices such as an electronic component and a heat sink (another electrical component)." . <http://webisa.webdatacommons.org/292112185> <http://www.w3.org/ns/prov#wasQuotedFrom> <freshpatents.com> . <http://webisa.webdatacommons.org/prov/217978061> <http://www.w3.org/ns/prov#wasDerivedFrom> <http://webisa.webdatacommons.org/292112185> .