<http://webisa.webdatacommons.org/292759617>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .
<http://webisa.webdatacommons.org/prov/104273885>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/292759617> .
<http://webisa.webdatacommons.org/prov/297846094>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/292759617> .
<http://webisa.webdatacommons.org/292759617>	<http://www.w3.org/ns/prov#value>	"First, solder paste or other material serving the same function may be applied to the upper surface of the chip carrier." .
<http://webisa.webdatacommons.org/292759617>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .