<http://webisa.webdatacommons.org/292863429>	<http://www.w3.org/ns/prov#value>	"FIG. 4A is a flowchart of fabricating a semiconductor chip package according to the second embodiment of this invention." .
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<http://webisa.webdatacommons.org/292863429>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .
<http://webisa.webdatacommons.org/prov/98505150>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/292863429> .