<http://webisa.webdatacommons.org/296019475>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/296019475>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/22486765>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/296019475> .
<http://webisa.webdatacommons.org/296019475>	<http://www.w3.org/ns/prov#value>	"Alternatively, the seed layer 252 b, such as copper, can be sputtered, electroless plated or electroplated on the adhesion/barrier layer 252 a formed by first sputtering a chromium layer and then sputtering a chromium-copper-alloy layer on the chromium layer, and then the metal layer 282 is electroplated or electroless plated on the seed layer 252 b." .