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<http://webisa.webdatacommons.org/299135557>	<http://www.w3.org/ns/prov#value>	"A method according to claim 1, including reducing the thickness of said semiconductor circuit substrate in a region of the substrate, and forming said via holes through the region.3." .
<http://webisa.webdatacommons.org/prov/132802620>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/299135557> .
<http://webisa.webdatacommons.org/299135557>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<patentgenius.com> .