<http://webisa.webdatacommons.org/prov/45356711>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/299667707> .
<http://webisa.webdatacommons.org/prov/47793092>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/299667707> .
<http://webisa.webdatacommons.org/299667707>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/299667707>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/299667707>	<http://www.w3.org/ns/prov#value>	"1) Memory modules are made by low-temperature compatible processes and materials i.e. polymers or low temperature processing of poly- or micro- or amorphous silicon." .