. "The present invention relates to a heat activatable adhesive composition comprising (1) a liquid, ethylenically unsaturated monomer, oligomer or prepolymer of the formula: ##STR5## wherein R is H or CH3, R1 is an organic moiety and n is at least 2, (2) a thermal initiator selected from the group consisting of substituted or unsubstituted pinacols, azo compounds, thiurams, organic peroxides and mix" . . . .