<http://webisa.webdatacommons.org/304086225>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/304086225>	<http://www.w3.org/ns/prov#value>	"20100279491DIE ATTACH FILM-PROVIDED DICING TAPE AND PRODUCTION PROCESS OF SEMICONDUCTOR DEVICE - The present invention provides a die attach film-provided dicing tape, which includes a dicing tape, a supporting tape and a die attach film laminated in this order, wherein the supporting tape is a tape having a self-rolling peelability, and a process for producing a semiconductor device by using the" .
<http://webisa.webdatacommons.org/prov/176775850>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/304086225> .
<http://webisa.webdatacommons.org/304086225>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<faqs.org> .