. . "This insulating layer 1720 can be formed by an inorganic insulating material such as silicon oxide, silicon nitride, silicon oxynitride, aluminum oxide, aluminum nitride, and aluminum oxynitride, acrylic acid, methacrylic acid, and a derivative thereof, a high molecular weight material having heat resistance such as polyimide, aromatic polyamide, or polybenzimidazole, an inorganic siloxane insulat" . . . . . .