<http://webisa.webdatacommons.org/prov/245563272>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/305274626> .
<http://webisa.webdatacommons.org/305274626>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/305274626>	<http://www.w3.org/ns/prov#value>	"The Through-Silicon-Via (TSV) stacked die concept is an emerging technology which requires wafer-to-wafer or wafer-to-support system (carrier) bonding." .
<http://webisa.webdatacommons.org/305274626>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .