"The bonding wires containing 315 B and 319 B connect die 100 B with leads containing 415 B and 419 B. Finally, a molding compound 500 B completes an external shape of a semiconductor package by molding inner connection portions of the semiconductor integrated circuit die 100 B, the bonding wires containing 315 B and 319 B, and the respective leads 415 B and 419 B and is a material for protecting e" . . . .