<http://webisa.webdatacommons.org/307370765>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .
<http://webisa.webdatacommons.org/prov/158799851>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/307370765> .
<http://webisa.webdatacommons.org/307370765>	<http://www.w3.org/ns/prov#value>	"ht emission and method of makingUS551462724 Ene 19947 May 1996Hewlett-Packard CompanyIncreasing the resistance of a light emitting diode and other semiconductor devices to extremes of temperatureUS551672720 Ene 199514 May 1996International Business Machines CorporationMethod for encapsulating light emitting diodesUS55197205 Ene 199421 May 1996Mitsubishi Denki Kabushiki KaishaSemiconductor light em" .
<http://webisa.webdatacommons.org/307370765>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .