. . . "The conductive material such as copper (CU), nickel (Ni), aluminum (Al), rhodium (Rh), palladium (Pd), tungsten (w) or other material, nickel-cobalt (NiCo) or other alloy combinations thereof is deposited (electroplated) in the pattern ???A??? of the photoresist layer 414 to form the contactor 230 as shown in FIG. 8G. Preferably, a conductive material which is different from that of the conductive" . . . . . . .