. . "The orifice of the cover member can be formed chemically, mechanically or using any means such as laser irradiation, ion etching or the like. [0100] In the fine channel device of the present invention, the substrate having a fine channel and the cover member can be laminated in one piece by means of thermal bonding or adhesion bonding using an adhesive such as a photo-setting resin or a heat-setti" . .