<http://webisa.webdatacommons.org/310944903>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/310944903>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.fr> .
<http://webisa.webdatacommons.org/prov/312818102>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/310944903> .
<http://webisa.webdatacommons.org/prov/179932878>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/310944903> .
<http://webisa.webdatacommons.org/prov/42076458>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/310944903> .
<http://webisa.webdatacommons.org/310944903>	<http://www.w3.org/ns/prov#value>	"Thermoplastic materials suitable for the process of the invention include polyolefins such as ethylene and propylene homopolymers, copolymers, terpolymers, etc." .