<http://webisa.webdatacommons.org/316159634>	<http://www.w3.org/ns/prov#value>	"FIGS. 5A and 5B are a plan view and a sectional view, respectively, showing a semiconductor device, before resin molding, of the first embodiment according to the invention;" .
<http://webisa.webdatacommons.org/prov/332764378>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/316159634> .
<http://webisa.webdatacommons.org/prov/333987245>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/316159634> .
<http://webisa.webdatacommons.org/316159634>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/316159634>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .