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<http://webisa.webdatacommons.org/324186663>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<docstoc.com> .
<http://webisa.webdatacommons.org/324186663>	<http://www.w3.org/ns/prov#value>	"CMP process 308. As such, if the copper thickness was not uniform after ECP step 306, the CMP step 308 can be used to correct the non-uniformity by adjusting the polishing rate, duration, slurry or other parameters." .