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<http://webisa.webdatacommons.org/prov/450090891>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/326728086> .
<http://webisa.webdatacommons.org/326728086>	<http://www.w3.org/ns/prov#value>	"The method for etching is not particularly limited, and for example, when thepeel-off layer 721 is formed to include silicon, the peel-off layer 721 can be removed with the use of ClF.sub.3 gas, a gas such as b" .
<http://webisa.webdatacommons.org/326728086>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<patentgenius.com> .