<http://webisa.webdatacommons.org/prov/47843946>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/331507612> .
<http://webisa.webdatacommons.org/331507612>	<http://www.w3.org/ns/prov#value>	"Further, if the packaging substrate 12 is made of ceramics, any other materials other than LTCC and alumina may be used as the kind of the substrate member. [0081] In addition, a surface on which the predetermined conductive patterns are formed in the SAW element 11 is located opposite to the packaging substrate 12." .
<http://webisa.webdatacommons.org/331507612>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/prov/428681721>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/331507612> .
<http://webisa.webdatacommons.org/331507612>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .