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<http://webisa.webdatacommons.org/33672656>	<http://www.w3.org/ns/prov#value>	"Awards are an important part of this yearly conference and the pre-imminent packaging award is IEEE CPMT???s (Component, Packaging and Manufacturing Technology Society) ???Field Award??? Past years winners include Rao Tummala (packaging), Yutaka Tsukada (underfilling), Paul Totta (bumping); Herb Reichl (packaging); George Harman (wire bonding), Dimitri Grabbe (connectors) and CP Wong (polymers)." .