<http://webisa.webdatacommons.org/337865518>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/337865518>	<http://www.w3.org/ns/prov#value>	"Of course, the epoxy or other curable material with a curing temperature near the reflow temperature must have a curing temperature which is less than the reflow temperature of the solder used on the die so that as the epoxy or other curable material cures, the solder does not reflow." .
<http://webisa.webdatacommons.org/prov/292921973>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/337865518> .
<http://webisa.webdatacommons.org/337865518>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com.au> .
<http://webisa.webdatacommons.org/prov/105589152>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/337865518> .