<http://webisa.webdatacommons.org/prov/11145630>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/338684890> .
<http://webisa.webdatacommons.org/338684890>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/338684890>	<http://www.w3.org/ns/prov#value>	"Therefore, if an identical polishing pad is repeatedly used for polishing semiconductor wafers, problems such as lowered polishing rate and uneven polishing are caused." .
<http://webisa.webdatacommons.org/338684890>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .