<http://webisa.webdatacommons.org/347758508>	<http://www.w3.org/ns/prov#value>	"ew showing the manufacturing method of the semiconductor device according to the first embodiment; [0014]FIGS. 4A and 4B are a sectional view and plan view showing the vicinity of a dummy wire of the semiconductor device according to the first embodiment; [0015]FIGS. 5A and 5B are sectional views showing peels of insulating films inside a layer or between layers according to a conventional techniq" .
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