<http://webisa.webdatacommons.org/prov/300509020>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/352305661> .
<http://webisa.webdatacommons.org/352305661>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<patents.com> .
<http://webisa.webdatacommons.org/352305661>	<http://www.w3.org/ns/prov#value>	"More particularly, the present invention relates to mounting an electronic device, such as a semiconductor chip made primarily of silicon, directly on an organic substrate, such as printed circuit board made primarily of glass" .
<http://webisa.webdatacommons.org/352305661>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .