<http://webisa.webdatacommons.org/prov/332629442>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/358578414> .
<http://webisa.webdatacommons.org/358578414>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/333007731>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/358578414> .
<http://webisa.webdatacommons.org/prov/333100064>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/358578414> .
<http://webisa.webdatacommons.org/prov/332926300>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/358578414> .
<http://webisa.webdatacommons.org/358578414>	<http://www.w3.org/ns/prov#value>	"FIGS. 6A and 6B are a cross-sectional view and a plan view, respectively, of connection units of the semiconductor package, according to an embodiment of the present invention." .
<http://webisa.webdatacommons.org/358578414>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .