<http://webisa.webdatacommons.org/prov/420534330>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/363737703> .
<http://webisa.webdatacommons.org/prov/290840771>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/363737703> .
<http://webisa.webdatacommons.org/363737703>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .
<http://webisa.webdatacommons.org/363737703>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/363737703>	<http://www.w3.org/ns/prov#value>	"FIGS. 1a-1e illustrate a method for preparing and placing a patterned array of metal balls, or a ball grid array, onto semiconductors, microelectronic chips, or other substrates such as electronic packages or printed circuit boards." .