<http://webisa.webdatacommons.org/364132316>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/334330621>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/364132316> .
<http://webisa.webdatacommons.org/prov/333306110>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/364132316> .
<http://webisa.webdatacommons.org/prov/332764384>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/364132316> .
<http://webisa.webdatacommons.org/prov/333987251>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/364132316> .
<http://webisa.webdatacommons.org/364132316>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .
<http://webisa.webdatacommons.org/364132316>	<http://www.w3.org/ns/prov#value>	"FIGS. 5A and 5B are a side view and plan view, respectively, of a thermal induction plate 508 that can be used with embodiments of the invention in which the only parts of the thermal induction plate 508 that are exposed to the exterior of the integrated circuit package are protrusions 508g." .