<http://webisa.webdatacommons.org/36800633>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.ca> .
<http://webisa.webdatacommons.org/prov/466894988>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/36800633> .
<http://webisa.webdatacommons.org/36800633>	<http://www.w3.org/ns/prov#value>	"FIG. 16A is a longitudinal cross sectional view showing a package structure for a semiconductor power device according to a further modification (MODIFICATION 7) of the eighth embodiment of the present invention;" .
<http://webisa.webdatacommons.org/36800633>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .