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<http://webisa.webdatacommons.org/371944720>	<http://www.w3.org/ns/prov#value>	"FIGS. 3A and 3B are a plan view and a cross-sectional view taken along line a-a', respectively, of a CMP apparatus for a semiconductor wafer according to a first embodiment of the present invention; and" .
<http://webisa.webdatacommons.org/371944720>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .
<http://webisa.webdatacommons.org/371944720>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/332731173>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/371944720> .