<http://webisa.webdatacommons.org/374015030>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/374015030>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/374015030>	<http://www.w3.org/ns/prov#value>	"acturing method according to the present invention, FIGS. 5A, 5B, 5C, 5D and 5E are views for illustrating stepwise a second example of the IC element manufacturing method according to the present invention, and FIG. 6 is a plan view of a finished wafer having formed thereon a required conductive pattern inclusive of the antenna coil." .
<http://webisa.webdatacommons.org/prov/151275828>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/374015030> .