<http://webisa.webdatacommons.org/prov/98962643>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/376198400> .
<http://webisa.webdatacommons.org/376198400>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/102560851>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/376198400> .
<http://webisa.webdatacommons.org/376198400>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
<http://webisa.webdatacommons.org/376198400>	<http://www.w3.org/ns/prov#value>	"The printed circuit portion of the folding tag may be formed by masking and applying solder and/or gold, silver, copper or other conductive materials to form conductive traces by dipping, plating or any other appropriate process." .