<http://webisa.webdatacommons.org/prov/373414041>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/384091431> .
<http://webisa.webdatacommons.org/384091431>	<http://www.w3.org/ns/prov#value>	"The present invention relates to a circuit board and a semiconductor package using the same, and more particularly to a circuit board having a conductive shield member and a semiconductor package using the same." .
<http://webisa.webdatacommons.org/384091431>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/230105334>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/384091431> .
<http://webisa.webdatacommons.org/384091431>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .