<http://webisa.webdatacommons.org/prov/219679915> <http://www.w3.org/ns/prov#wasDerivedFrom> <http://webisa.webdatacommons.org/386087762> . <http://webisa.webdatacommons.org/386087762> <http://www.w3.org/ns/prov#wasQuotedFrom> <patentgenius.com> . <http://webisa.webdatacommons.org/386087762> <http://www.w3.org/ns/prov#value> "A distinction is as a rule madehere between physical deposition processes (PVD processes, such as e.g. vapor deposition, sputtering or ion-plating), in which the starting material is present in condensed form, and chemical deposition processes (CVD processes), in which a suitablegaseous starting compound is introduced into the coating chamber, decomposed and in this case deposited in the form of a" . <http://webisa.webdatacommons.org/386087762> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://www.w3.org/ns/prov#Entity> .