<http://webisa.webdatacommons.org/404218285>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .
<http://webisa.webdatacommons.org/prov/463791436>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/404218285> .
<http://webisa.webdatacommons.org/404218285>	<http://www.w3.org/ns/prov#value>	"FIG. 4B is a diagrammatic cross sectional view taken along line A???A of a panel of packaged integrated circuits formed in accordance with another embodiment of the present invention." .
<http://webisa.webdatacommons.org/404218285>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .