<http://webisa.webdatacommons.org/prov/28561553>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/406658638> .
<http://webisa.webdatacommons.org/406658638>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/406658638>	<http://www.w3.org/ns/prov#value>	"The present invention, however, has application to a variety of manufacturingprocesses, such as plating, semiconductor manufacturing, machining, and any other process where material is added, subtracted, or otherwise c" .
<http://webisa.webdatacommons.org/406658638>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<patentgenius.com> .
<http://webisa.webdatacommons.org/prov/477393763>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/406658638> .