<http://webisa.webdatacommons.org/406741975>	<http://www.w3.org/ns/prov#value>	"The electroplateable pattern of the present invention is a pattern which is conducive to subsequent metal deposition and can comprise conductive metals, catalytic materials for subsequent metal deposition and the like." .
<http://webisa.webdatacommons.org/406741975>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .
<http://webisa.webdatacommons.org/406741975>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/prov/26739157>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/406741975> .