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<http://webisa.webdatacommons.org/prov/137763995>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/419226655> .
<http://webisa.webdatacommons.org/419226655>	<http://www.w3.org/ns/prov#value>	"Other features patterned in the second side include a die pad 44 thermally interconnected to the heat sink 42 and bond sites 46 for passive devices such as resistors or capacitors." .
<http://webisa.webdatacommons.org/419226655>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .