<http://webisa.webdatacommons.org/420999501>	<http://www.w3.org/ns/prov#value>	"In addition, devices such as rivets can put stress on the electronic package and may even cause failure of the package during thermal expansion and contraction." .
<http://webisa.webdatacommons.org/prov/154110737>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/420999501> .
<http://webisa.webdatacommons.org/420999501>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.es> .
<http://webisa.webdatacommons.org/420999501>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .