<http://webisa.webdatacommons.org/421808088>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<freshpatents.com> .
<http://webisa.webdatacommons.org/prov/464635632>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/421808088> .
<http://webisa.webdatacommons.org/421808088>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/421808088>	<http://www.w3.org/ns/prov#value>	"In embodiments, the wiring layer 14 can be a refractory metal such as Ti, TiN, TiN, Ta, TaN, and W and the like, or AlCu, or a noble metal such as, for example, Au, Pt, Ru, Ir, and the like amongst other wiring materials." .