<http://webisa.webdatacommons.org/424157057>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com.au> .
<http://webisa.webdatacommons.org/424157057>	<http://www.w3.org/ns/prov#value>	"Metallic bonding layers comprise evaporated or sputter-deposited films of Cu or Ni or other metallic element or alloy selected for its thermally activated mass diffusion and grain growth characteristics." .
<http://webisa.webdatacommons.org/prov/469489620>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/424157057> .
<http://webisa.webdatacommons.org/prov/236476502>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/424157057> .
<http://webisa.webdatacommons.org/424157057>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .