<http://webisa.webdatacommons.org/425183957>	<http://www.w3.org/ns/prov#value>	"Although the electroless technique provides an economical, simple and effective method for providing an under-bump barrier layer, contacting material such as solder or adhesive is still required for assembling." .
<http://webisa.webdatacommons.org/425183957>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<google.com> .
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<http://webisa.webdatacommons.org/prov/104273885>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/425183957> .
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