<http://webisa.webdatacommons.org/prov/374720455>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/432704343> .
<http://webisa.webdatacommons.org/432704343>	<http://www.w3.org/1999/02/22-rdf-syntax-ns#type>	<http://www.w3.org/ns/prov#Entity> .
<http://webisa.webdatacommons.org/432704343>	<http://www.w3.org/ns/prov#value>	"Such substrates may contain one or more additional layers of materials, such as, but not limited to, dielectric layers and conductive layers such as metals." .
<http://webisa.webdatacommons.org/432704343>	<http://www.w3.org/ns/prov#wasQuotedFrom>	<freepatentsonline.com> .
<http://webisa.webdatacommons.org/prov/239734986>	<http://www.w3.org/ns/prov#wasDerivedFrom>	<http://webisa.webdatacommons.org/432704343> .